More Performance

• Supporting up to 40 Cores and 80 threads (10 cores/20 threads per CPU); 30MB shared cache with the introduction of the new Intel® Xeon® Processor E7 series

More Expandable

• 2X memory capacity, supporting up to 2.0TB (32GB DDR3 DIMMs)* and support for a new (E7) Memory Cartridge*

More Reliable

• Double Device Data Correction - DDDC* (Ready), this feature extends the capability to withstand failures in two x4 DRAM devices. Systems supporting DDDC can fix both single- and double-DRAM device memory hard errors. This feature greatly extends system up-time

More Efficient

• Support for Low Voltage DIMMS*

More Secured

• Trusted Execution Technology - TXT* (Ready)
• Advanced Encryption Standard-New Instructions (AESNI)*

* These new features applicable only to the Intel® Xeon® Processor E7 series

The Flash Backed Write Cache (FBWC) increases cache data retention capabilities from two days of existing battery backed write cache (BBWC) to infinite data retention.

• Standard on all Models
• Transportable data protection
• Increases overall controller performance

Microsoft Windows Server
Red Hat Enterprise Linux (RHEL)
SUSE Linux Enterprise Server (SLES)
Oracle Solaris
VMware
Citrix XenServer

Managing the growing number of servers can be complex and expensive for your organization. IT managers need to address changing business needs with tools that meet the challenges of managing today's complex Datacenters.

HP provides management solutions that are designed to simplify a server's installation, configuration and maintenance throughout the entire server lifecycle. This provides the customer with higher levels of operational efficiency and highly reliable systems: www.hp.com/go/foundation.

The foundation pack includes:

• HP SmartStart
• HP Management DVD
• HP ProLiant Smart Update Firmware DVD

SmartStart version supported (minimum): SmartStart 8.50
https://www.hp.com/servers/smartstart

NOTE: In an effort to support reducing our environmental impact, the HP Insight Foundation Suite for ProLiant media will be available as a selectable option for this server at time of order of a CTO SKU. This will allow customers to order the number of media kits that best meet their needs and eliminate receiving unnecessary duplicate media.

HP Integrated Lights-Out (iLO) simplifies server setup, health monitoring, power and thermal control, and lights-out remote administration of ProLiant ML, DL, and BL servers. HP iLO functions without additional software and can be accessed from any location via a web browser. HP iLO works hand-in-hand with HP Systems Insight Manager, Insight Control and Insight Dynamics for ProLiant, helping customers unleash the value of the ProLiant platform and deliver the highest possible quality of IT service. For more information, visit: www.hp.com/go/iLO

HP Insight Control

HP Cluster Platforms

HP Factory Express offers configuration, customization, integration and deployment services for HP servers and storage products. Customers can choose how their factory solutions are built, tested, integrated, shipped and deployed.

Factory Express offers service packages for simple configuration, racking, installation, complex configuration and design services as well as individual factory services, such as image loading, asset tagging, and custom packaging. HP products supported through Factory Express include a wide array of servers and storage: HP Integrity, HP ProLiant, HP ProLiant Server Blades, HP BladeSystem, HP 9000 servers as well as the MSAxxxx, VA7xxx, EVA, XP, rackable tape libraries and configurable network switches.

For more information on Factory Express services for your specific server model please contact your sales representative or go to: https://www.hp.com/go/factory-express.

The HP eConfigure-Enterprise Configurator now provides factory default racking for our HP hardware portfolio. This approach is aligned with our strategic direction to meet the needs and expectations of our valued customers. If you require "custom" rack configuration, please contact HP's Customer Business Center or an Authorized Partner for assistance. https://www.hp.com/products/configurator.

HP Technology Services for Industry Standard Servers and BladeSystem
Capitalizing on HP ProLiant server and HP BladeSystem capabilities requires a service partner who understands your increasingly complex business technology environment. That's why it makes sense to team up with the people who know HP infrastructure hardware and software best - the experienced professionals at HP Services.

What HP ProLiant and BladeSystem Services can do for you
HP ProLiant and BladeSystem Services can help you design, deploy, test, integrate, support, and manage IT and infrastructure solutions. This way, HP proposes services solutions that include more than just uplift of base warranty. You can get the support you need by choosing from one of a number of service packaged solutions we have designed to address wider set of customer support needs:.

HP Technology Services meets business challenges with services offered in three packages -
Optimized Care Package, Standard Care Package, and Basic Care Package - available for each product group. Such packaged solutions enable customers to optimize technology operations, minimize risk and drive better business outcomes with easy-to-buy, easy-to-use scalable support packages for servers, storage, networking and software.

HP NC375i Integrated Quad Port Multifunction Gigabit Server Adapter
Two HP DL580G7 Memory Boards
Five standard PCI-express slots
HP Smart Array P410i/ Zero Memory Controller
Four redundant hot-plug fans
SFF SAS/SATA/SSD drive cage
HP Slim SATA DVD-ROM Optical Drive
HP Integrated Lights-Out 3 (iLO 3) management processor: integrated on system board
Rack (4U), 7-inch
NOTE: Power supplies need to be selected separately from Step 2 below.
NOTE: Customer purchasing the Intel® Xeon® Processor 7500 series will need to purchase the HP DL580R07 CTO Server (PN 588857-B21)

DL580G7 PCI-X / PCI Express I/O Exp. Kit
NOTE: Adds two PCI-E 2.0 x16, one PCI-E 2.0 x4 and two PCI-X
Suggested Slot placement:

1. Slot 3 PCIe2 x 16 (16,8,4,2,1)
2. Slot 6 PCIe2 x 16 (16,8,4,2,1)
3. Slot 9 PCIe2 x 16 (8,4,2,1)*
4. Slot 11 PCIe2 x 16 (8,4,2,1)*
5. Note - Slot 9 and 11 are physically a x16 slot but will operate electrically at x8.

AF616A

AF617A

HP ProLiant DL580 G7

Memory Subsystem Architecture
Intel® Xeon® processor E7 and 7500 series memory architecture is designed to take advantage of multiple stages of memory interleaving to reduce latency and increase bandwidth.

Each processor contains two Memory Controllers as shown in the Processor/Memory interconnect figure below. Each Memory controller has two Scalable Memory Interface (SMI) buses operating in lockstep where each SMI bus connects to a memory buffer. The purpose of the buffer is to convert SMI to DDR3. Each buffer has two DDR3 channels and can support up to four DIMMs for a total of eight DIMMs per cartridge.

• Memory speed is not affected by number of DIMMs or ranks. All DIMMs will run at the highest possible speed for a given processor.
• DDR3 memory speed is a function of the processors QPI bus speed such that
  • Processors with a QPI speed of 6.4GT will run memory at 1066MHz
  • Processors with a QPI speed of 5.6GT will run memory at 978MHz
  • Processors with a QPI speed of 4.8GT will run memory at 800 MHz

DIMM Installation guidelines
Each memory cartridge can support up to 8 DIMMs, for a system total of 64 DIMMs. When installing DIMM modules in the Memory Cartridge observe the following minimum guidelines:

• UDIMMs are not supported
• Minimum allowable configuration is two DIMMs per cartridge.
• DIMMs must be installed in pairs with identical characteristics. For configuration simplicity HP recommends using identical part numbered DIMMs throughout when possible.
• DIMM pairs MUST be populated in sequence by letter designation. Install DIMM pair 1A, 8A first followed by DIMM pair 3B, 6B then DIMM pair 2C, 7C and DIMM pair 4D, 5D last.
• Maximum performance is achieved by balancing DIMM pairs by letter groupings across all memory cartridges. Such that the 1A, 8A pair is install in all memory cartridges first (see diagram below) followed by the B pair, C pair and D pair.
• AMP modes Online Sparing and Memory Mirroring have further requirements beyond these listed here. Please refer to the user guide for additional memory configuration requirements.

Memory Cartridge population guidelines
This server contains 8 memory cartridge slots in the processor memory drawer. Observe the following guidelines:

• Populate memory cartridge slots for a processor only if the processor is installed where:
  • Processor 1 connects to cartridge slots 1 and 2.
  • Processor 2 connects to cartridge slots 3 and 4.
  • Processor 3 connects to cartridge slots 5 and 6.
  • Processor 4 connects to cartridge slots 7 and 8.
• Minimum recommended cartridge population is one cartridge per processor. For best performance two cartridges per processor are recommended.
• Processors installed without corresponding memory cartridges will incur high memory access latencies and is not recommended.
• To maximize performance in multi-processor configurations distribute the total memory capacity evenly between all processors.

Hemisphere mode
The architecture incorporates hemisphere mode, a high performance interleaving technology. Hemisphere mode allows interleaving between the two processor memory controllers internal to each processor.

Hemisphere mode is enabled when all processors in a system have the memory behind both memory controllers populated identically.

• To enable each processor to enter hemisphere mode it must have both cartridges installed, populated with equal memory capacities and follow the DIMM installation guidelines.

Memory Performance Optimization
The DL580 G7 supports 64 DIMMs across four multi-core processors. While there are many DIMM population configurations that can support any desired total memory size, optimal performance can only be achieved when DIMMs are populated to take advantage of the architecture. Reference the Figure: Hemisphere Population Diagram to achieve the best performance for a given memory/processor configuration.

• The largest contributor to maximum memory bandwidth performance is to utilize both memory controllers inside the processor. This is achieved by populating both memory cartridges for each installed processor.
• The second largest contributor to performance is to populate each DDR3 channel in each memory cartridge. To achieve this, the minimum DIMM count per cartridge is four. Maximum bandwidth is reached by fully populating all memory cartridges with the maximum number of eight DIMMs per cartridge.
• Best performance is obtained when all installed processors are enabled for Hemisphere mode. HP recommends two memory boards per processor- each one with at least 4 DIMMs- for improved memory bandwidth
• Hemisphere mode is optimum when four or eight DIMMs are installed per cartridge. Hemisphere mode can be reached with two or six DIMMs per cartridge (2 cartridges per processor) but it is not optimal configuration for Hemisphere mode.
• Plan your memory configurations using Identical DIMMs to reach your memory size target taking into account that 32 and 64 DIMM count configurations result in the highest performance. For a 4 processor example:
  • If initial memory target is 64GB then populate a 4 processor system with eight cartridges of 4 - 2GB DIMMs each for a total of 32 DIMMs. Your maximum expansion target is 128GB with 64 2GB DIMMs.
  • For 4GB DIMMs your initial memory target is 128GB using 32 DIMMs. Your maximum expansion target is 256GB with 64 DIMMs.
  • For 8GB DIMMs your initial memory target is 256GB using 32 DIMMs. Your maximum expansion target is 512GB with 64 DIMMs.
  • Maximum system memory capability is reached with an initial memory target of 512GB with 32 - 16GBDIMMs and 2TB with 64 32GB DIMMs.
• The more ranks per DIMM the higher the performance such that Quad rank DIMMs perform better than dual rank DIMMs.

NOTE: Memory configurations listed do not apply to "Factory Integrated Models". Only registered (RDIMM) speeds of 1066 or 1333 running at 1066 are supported and must be installed in pairs. UDIMMs are not supported.

Optical Drives

HP Smart Array P212/Zero Memory Controller
HP Smart Array P212/256 MB Controller
HP Smart Array P410/256 MB Controller
HP Smart Array P410/512 MB BBWC Controller
HP Smart Array P410/512 MB FBWC Controller
HP Smart Array P410/1G FBWC Controller
HP Smart Array P411/256MB Controller
HP Smart Array P411/512MB with BBWC Controller
HP Smart Array P411/512MB Flash Backed Write Cache
HP Smart Array P411/1G Flash Backed Write Cache
HP Smart Array P812/1G Flash Backed Cache Controller

External Storage

Maximum Storage Capacity - (External SAS Enclosure Attached)

Internal

HP StorageWorks USB Tape Drives
DAT 40
DAT 72
DAT 160
DAT 320
1U USB Rack-Mount Kit

System Unit

Dimensions (H x W x D)
(with bezel)

6.94" x 19.0" x 27.55" (17.6cm x 48.3cm x 70.0cm)

Weight
(approximate)

Input Requirements
(per power supply)

Relative Humidity
(non-condensing)

Smart Array P410i Controller

RAID 6, 6+0 (Advanced Data Guarding)
NOTE: RAID 6, 6+0 can be enabled with one of the following combinations:

• 256 MB cache, Battery kit and Smart Array Advanced Pack License key option upgrades
• 512 MB BBWC/FBWC and Smart Array Advanced Pack License key option upgrades
• 1G FBWC and Smart Array Advanced Pack License key option upgrades

HP NC375i Integrated Quad Port Multifunction Gigabit Server Adapter

Environment-friendly Products and Approach

Hewlett-Packard offers end-of-life HP product return, trade-in, and recycling programs in many geographic areas. For trade-in information, please go to: https://www.hp.com/go/green. To recycle your product, please go to: https://www.hp.com/go/green or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: https://www.hp.com/go/green. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.